Intel 10M04SAU169C8G: A Compact Powerhouse for Low-Power Embedded System Design
In the rapidly evolving world of embedded systems, designers are perpetually challenged to balance performance, power consumption, and physical size. The Intel 10M04SAU169C8G, a member of the Intel Max® 10 FPGA family, emerges as a compelling solution that masterfully addresses this trilemma. This device is not just another programmable logic chip; it is a highly integrated system-on-chip (SoC) alternative that packs a significant punch within an ultra-compact form factor, making it ideal for space-constrained and power-sensitive applications.
The "10M04" designation reveals its core identity: it features 4,000 logic elements (LEs), providing ample programmable fabric for implementing complex control logic, data processing paths, and custom interfaces. This capacity allows it to replace a board full of discrete logic components, microcontrollers, and ASSPs (Application-Specific Standard Products), thereby simplifying design, reducing the bill of materials (BOM), and enhancing overall system reliability.
A standout feature of the Max® 10 family, and this device in particular, is its remarkably low power consumption. Unlike FPGAs that require external configuration memory and multiple power rails, the 10M04SAU169C8G is built on a flash-based process. This technology enables instant-on operation and eliminates the static power draw associated with SRAM-based FPGAs. Its single-chip nature, requiring only a single 3.3V or 2.5V power supply, drastically simplifies power management design—a critical advantage for battery-operated or always-on embedded systems.
Further bolstering its integration credentials, this FPGA incorporates hard intellectual property (IP) blocks directly onto the die. It includes embedded memory blocks (M9K) for data buffering, dual-configuration flash for redundancy, and a unique capability for its class: built-in analog-to-digital converters (ADCs). The inclusion of an ADC allows designers to directly interface with analog sensors, reducing the need for external components and saving even more board space and cost.
Housed in the miniature 8x8mm, 169-ball Ultra FineLine BGA (U169) package, the 10M04SAU169C8G is engineered for the most demanding size constraints. This package is a testament to its target application in portable medical devices, industrial sensor modules, motor control units, and communication accessories where every square millimeter is precious.
Despite its small size, it does not compromise on performance. The device supports various I/O standards and can interface with common peripherals like DDR3 memory, SPI, I2C, and UARTs. This flexibility allows it to act as a versatile system glue and processing hub, orchestrating communication between various sub-systems within a larger design.
ICGOODFIND: The Intel 10M04SAU169C8G stands out as a premier choice for engineers. It successfully merges the low-power and instant-on attributes of a CPLD with the high integration and flexibility of an FPGA. For designers crafting the next generation of intelligent, compact, and efficient embedded products, this device offers a powerful, all-in-one platform that accelerates development and optimizes the final product's form factor and power profile.
Keywords: Low-Power FPGA, Embedded Systems, Intel Max 10, System-on-Chip (SoC), BGA Package.
